Deep RIE SLR ICP

Deep RIE SLR ICP
Deep RIE SLR ICP

Manufacturer and model:

Plasmatherm SLR-770 DRIE Bosch Process.

 

Description:

MEMS and nanotechnology applications frequently require features with relatively high aspect ratios and anisotropic profiles to be created in silicon. This is usually accomplished using the Bosch process, also known as deep silicon etching (DSE) or deep reactive ion etching (DRIE).

 

Specification:

  • Recommended for MEMS production.
  • Including Bosch process - the cyclic isotropic etching and fluorocarbon-based protection film deposition.
  • The typical etching rate for 4 inch silicon wafer: ~0.21 um/cycle.


Location:

Engineering Cleanroom, Wolfson building of Electrical Engineering.

 

Tool Owner:

Dr. Valery Garber (Valeryg@tauex.tau.ac.il).

 

Tool Trainer:

Neta Melech (net.melech@gmail.com).

 

Rates & Costs for external Commercial / Industrial:

Clean Room - 200 NIS / hr.

Tool - 440 NIS / hr.

Staff Time - 440 NIS / hr.

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