Diode Sputtering MRC 8620

Diode Sputtering MRC 8620
Diode Sputtering MRC 8620

Manufacturer and model:

RF Diode Sputtering System MRC 8620-VST.



Au, Ag, Co, Cr, Cu, Ni, Ta, Ti, W, CF2, ITO, SO, SiO2, SiNx, TaN, TiN, TiO2.



  • Up to 6‘’ wafers.
  • No load lock.
  • Base pressure 8x10-7Torr.
  • Working pressure 5x10-3 – 50x10-3 Torr.
  • 3 targets.
  • Reactive sputtering with N2 and O2.
  • Substrate biasing possibility, also during sputtering process.


Room #301, Wolfson building of Electrical Engineering.


Tool Owner:

Gidon Jacob (gjacob@tauex.tau.ac.il).


Tool Trainer:

Gidon Jacob (gjacob@tauex.tau.ac.il).

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