Mask Aligner MA6

Mask Aligner MA6
Mask Aligner MA6

Manufacturer and model:

KARL SUSS MA/BA6 Mask Aligner.

 

Description:

The SUSS MA/BA6 mask aligner is widely recognized as a benchmark in semiconductor submicron research and microsystems production.

 

It is designed for all standard lithography applications and wafer sizes of up to 150 mm. For thick-resist MEMS applications, the MA/BA6 offers high resolution and optimum edge quality.

 

The bottom side alignment option allows for pattern printing on both sides of the substrate.

 

Specification:

  • Flood exposure, soft, hard, and vacuum contact capable.
  • Topside and backside alignment.
  • 1 µm feature size. resolution in thin resist.
  • Chucks and mask holders in different sizes.
  • Processing of wafers or squares from 2" to 150mm.


Location:

Engineering Cleanroom, Wolfson building of Electrical Engineering.

 

Tool Owner:

Dr. Boris Yofis (boris.yofis@gmail.com). 

 

Tool Trainer:

Erez Benjamin (erezbenj@mail.tau.ac.il).

 

Rates & Costs for external Commercial / Industrial:

Clean Room - 200 NIS / hr

Tool - 440 NIS / hr

Staff Time - 440 NIS / hr.

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