Mask Aligner MA6

Manufacturer and model:

KARL SUSS MA/BA6 Mask Aligner.

Description:

The SUSS MA/BA6 mask aligner is widely recognized as a benchmark in semiconductor submicron research and microsystems production.

It is designed for all standard lithography applications and wafer sizes of up to 150 mm. For thick-resist MEMS applications, the MA/BA6 offers high resolution and optimum edge quality.

The bottom side alignment option allows for pattern printing on both sides of the substrate.

Specification:

• Flood exposure, soft, hard, and vacuum contact capable.
• Topside and backside alignment.
• 1 µm feature size. resolution in thin resist.
• Chucks and mask holders in different sizes.
• Processing of wafers or squares from 2" to 150mm.

​Location:

Engineering Cleanroom, Wolfson building of Electrical Engineering.

Tool Owner:

Dr. Boris Yofis (boris.yofis@gmail.com). 

Tool Trainer:

Erez Benjamin (erezbenj@mail.tau.ac.il).

Rates & Costs for external Commercial / Industrial:

Clean Room - 200 NIS / hr

Tool - 440 NIS / hr

Staff Time - 440 NIS / hr.