Dicing Disco Saw

Manufacturer and model:

Disco DAD 3350.

Description:

The Disco is a high-precision dicing machine designed for cutting a wide range of wafer materials, including Silicon, Sapphire, Quartz, and Silicon Carbide. This advanced dicing tool ensures clean, accurate, and efficient wafer separation, making it ideal for semiconductor manufacturing, MEMS fabrication, and material research.