Future Capability

The new equipment coming soon to TAU CCNS

At the TAU Nanocenter, we continuously advance our research and fabrication capabilities by acquiring state-of-the-art tools to meet the evolving needs of cutting-edge nanotechnology.

With recent investments in advanced deposition, etching, and wafer processing equipment, we can offer a wider range of high-precision processes.

These new tools enable our researchers and partners to push the boundaries of micro and nanofabrication, providing innovative solutions for applications in semiconductors, 3D integration, and beyond

Tool Name	Process	Application / Description	Specifications	Additional Notes

CORIAL 210 ICP-CVD	Deposition (CVD)	Deposits thin films of device-grade quality; ideal for hydrogenated amorphous silicon (a-Si) and various silicon compounds.	Low-temp deposition (<200°C); Conformal coating of trenches and vias with high aspect ratios; equipped with vacuum load lock.	Complementary to PECVD system, enabling lift-off processes.

CORIAL 210 IL-187 ICP-RIE	Dry Etching (RIE)	High-density plasma for etching metals (e.g., Al, Ti, Au), metal oxides, and semiconductor compounds	Supports corrosive plasma chemistries, stable etch rates, excellent uniformity, deep substrate etch (DSE) capabilities.	Uses halogen-based plasmas for selective chemical dry etching.

CORIAL 210 IL-189 ICP-RIE	Dry Etching (RIE)	Primarily for etching silicon oxides, oxide glasses, and silicon nitrides using fluorine-oxygen-based plasmas.	Configured similarly to IL-187 but uses gases like SF6, CF4, and CHF3 for oxide etching.

EVATEC BAK501 E-Gun Evaporator	Deposition (PVD)	Multilayer deposition of metals and dielectric layers, optimized for lift-off and low-damage deposition.	Large substrate-source distance, 8-pocket e-gun, base pressure <2×10^-7 mBar, automation, ion-assisted deposition.	Deposits metals like Al, Cu, Au, and reactive oxides.

VST Multifunction PVD System TFDS 6400	Deposition (PVD)	E-gun evaporation and magnetron sputtering for metals and dielectric layers.	6” water-cooled holder, 5 magnetron sources for co-sputtering, 3 gas lines, cryogenic vacuum pump, and full automation.	Upgraded version of older VST e-gun evaporator and Penta sputter systems.

Disco DAG810 Surface Grinder	Surface Grinding	Wafer thinning, fabrication of Through Strata Vertical interconnects (TSVs) for 3D integration (3DI) applications.	Handles workpieces up to 200 mm, fixed abrasive grinding, surface roughness <10 nm, ultra-precise grinding results.	Supports extreme wafer thinning for 3DI technologies (stacked wafers, SiP systems).