New Equipment Arrival at TAU Nano Center's Clean Room!
This advanced tool will expand our research capabilities in wafer thinning, pre-engineered substrate fabrication, and Through-Strata Vertical Interconnects (TSVs) for 3D Integration (3DI)
Exciting news! TAU.nano has new addition to our clean room capabilities - a Surface Grinder (Disco DAG810 Semi-Automatic).
This advanced tool will expand our research capabilities in wafer thinning, pre-engineered substrate fabrication, and Through-Strata Vertical Interconnects (TSVs) for 3D Integration (3DI).
The DAG810 enables high-precision stacking of multiple wafers or chiplets into a single compact package.
Key Features:
- Precision Wafer Thinning: Achieve ultra-thin, uniform layers.
- Versatile Handling: Supports a variety of materials and components.
- Superior Surface Quality: Delivers extreme flatness and fine finishes.
This acquisition was made possible with partial funding from Intel Corporation, marking an exciting milestone in our collaboration. We appreciate Intel’s support, which is helping us advance research and development.
Additional equipment has also been purchased to further enhance TAU.nano's capabilities, with arrivals expected in the coming months.
Stay tuned for updates!
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