New State-of-the-Art Tools Elevate Our Research Capabilities

We are thrilled to announce the acquisition of three advanced tools that represent a significant leap forward in our fabrication and research capabilities.

These state-of-the-art systems will soon be installed and operational, supporting innovative research in micro and nanotechnology.

New Additions to Our Facility

• CORIAL 210 ICP-CVD
  Deposits device-grade thin films, including hydrogenated amorphous silicon, silicon oxides, nitrides, carbides, and diamond-like carbon.
  Features low-temperature operation (<200°C, with some processes possible at 50°C–75°C). Equipped with a vacuum load lock for high throughput and conformal coating of high-aspect-ratio structures.

• CORIAL 210 IL-187 ICP-RIE
  Advanced etching of metals, metal oxides and semiconductor compounds.
  Offers high-density plasma for selective chemical etching, stable etch rates, and precise deep substrate etch (DSE) processes.
   
• CORIAL 210 IL-189 ICP-RIE
  Designed for etching silicon oxides, oxide glasses and silicon nitrides.
  Optimized for fluorine-oxygen plasmas and tailored to oxide etching with gases like SF6, CF4, and CHF3.

These advanced tools will greatly expand the capabilities of our center, fostering groundbreaking research and enabling innovative applications in micro and nanotechnology.

We look forward to sharing updates as we approach installation and commissioning.