Dicing Disco Saw

Manufacturer and model:

Disco DAD 3350.

Description:

For cut a wide set of wafers such as Silicon, Sapphire, Quartz, Silicon Carbide, etc.

Specification:

• DAD3350 can handle a maximum of Φ8-inch or 250 x 250 mm workpieces.
• A 1.8 kW spindle is equipped as standard.
• Possible size of blades up to Φ5 inches.
• Cutting speed: 0.1～600 mm/s (depends on substrate type and thickness).
• Micro and Macro CCD Cameras.

​Location:

Wolfson building of Electrical Engineering, Room #301.

Tool Owner:

Bar favelukis ( barfavelukis@gmail.com)

Tool Trainer:

Bar favelukis ( barfavelukis@gmail.com)