Dicing Disco Saw
Manufacturer and model:
Disco DAD 3350.
Description:
For cut a wide set of wafers such as Silicon, Sapphire, Quartz, Silicon Carbide, etc.
Specification:
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DAD3350 can handle a maximum of Φ8-inch or 250 x 250 mm workpieces.
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A 1.8 kW spindle is equipped as standard.
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Possible size of blades up to Φ5 inches.
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Cutting speed: 0.1~600 mm/s (depends on substrate type and thickness).
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Micro and Macro CCD Cameras.
Location:
Wolfson building of Electrical Engineering, Room #301.
Tool Owner:
Bar favelukis ( barfavelukis@gmail.com)
Tool Trainer:
Bar favelukis ( barfavelukis@gmail.com)