Dicing Disco Saw

Dicing Disco Saw
Dicing Disco Saw

Manufacturer and model:

Disco DAD 3350.



For cut a wide set of wafers such as Silicon, Sapphire, Quartz, Silicon Carbide, etc.



  • DAD3350 can handle a maximum of Φ8-inch or 250 x 250 mm workpieces.
  • A 1.8 kW spindle is equipped as standard.
  • Possible size of blades up to Φ5 inches.
  • Cutting speed: 0.1~600 mm/s (depends on substrate type and thickness).
  • Micro and Macro CCD Cameras.



Wolfson building of Electrical Engineering, Room #301.


Tool Owner:

Bar favelukis ( barfavelukis@gmail.com)


Tool Trainer:

Bar favelukis ( barfavelukis@gmail.com)

Tel Aviv University makes every effort to respect copyright. If you own copyright to the content contained
here and / or the use of such content is in your opinion infringing, Contact us as soon as possible >>