Dicing Disco Saw

Dicing Disco Saw
Dicing Disco Saw

Manufacturer and model:

Disco DAD 3350.

 

Description:

For cut a wide set of wafers such as Silicon, Sapphire, Quartz, Silicon Carbide, etc.

 

Specification:

  • DAD3350 can handle a maximum of Φ8-inch or 250 x 250 mm workpieces.
  • A 1.8 kW spindle is equipped as standard.
  • Possible size of blades up to Φ5 inches.
  • Cutting speed: 0.1~600 mm/s (depends on substrate type and thickness).
  • Micro and Macro CCD Cameras.

 

Location:

Wolfson building of Electrical Engineering, Room #301.

 

Tool Owner:

Dr. Stanislav Stepanov (stass@tauex.tau.ac.il).

 

Tool Trainer:

Raz Samira (razsamira@mail.tau.ac.il). 

 

Rates & Costs for external Commercial / Industrial:

Room #301 – 200 NIS/hr.

Tool – 440 NIS/hr.

Staff Time – 440 NIS/hr.

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