DISCO DAG810
Manufacturer and model:
DISCO DAG810
Description:
The DISCO DAG810 is a high-precision, semi-automatic surface grinder designed for thinning and planarizing wafers and hard materials up to 8 inches (200 mm) in diameter.
It offers outstanding thickness uniformity and surface quality for applications in semiconductor fabrication, MEMS, sensors, and 3D integration processes.
With its rigid spindle design, stable grinding system, and easy-to-use control interface, the DAG810 ensures smooth, accurate, and repeatable material removal - ideal for wafer back-grinding, substrate planarization, and TSV/3DI processing.
Typical applications:
- Wafer thinning for MEMS and sensor devices
- Planarity improvement of sapphire, SiC, or piezoelectric materials
- Pre-engineered substrate preparation for chiplet and 3D integration
- Precision grinding of brittle materials such as glass and ceramics
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