Mask Aligner MA6 GEN4
Manufacturer and model:
KARL SUSS MA/BA6 GEN4 Mask Aligner.
Description:
The SUSS MA/BA6 mask aligner is widely recognized as a benchmark in semiconductor submicron research and microsystems production.
It is designed for all standard lithography applications and wafer sizes of up to 150 mm. For thick-resist MEMS applications, the MA/BA6 offers high resolution and optimum edge quality.
The bottom side alignment option allows for pattern printing on both sides of the substrate.
Specification:
- UV LED light source
- Uniformity<2.5%
- Manual & Automatic Wafer Alignment
- Flood exposure, soft, hard, and vacuum contact capable.
- Topside and backside alignment.
- 1 µm feature size. resolution in thin resist.
- Mask size: 4" , 5'" and 7".
- Sample sizes up to 6'' wafers. BSA of small pieces is supported by a glass chuck.
Location:
Nano Cleanroom, Nano center building.
Engineering Cleanroom, Wolfson building of Electrical Engineering.
Tool Owner:
Erez Benjamin (erezbenj@tauex.tau.ac.il).
Tool Trainer:
Erez Benjamin (erezbenj@tauex.tau.ac.il).