Mask Aligner MA6 GEN4

Manufacturer and model:

KARL SUSS MA/BA6 GEN4 Mask Aligner.

Description:

The SUSS MA/BA6 mask aligner is widely recognized as a benchmark in semiconductor submicron research and microsystems production.

It is designed for all standard lithography applications and wafer sizes of up to 150 mm. For thick-resist MEMS applications, the MA/BA6 offers high resolution and optimum edge quality.

The bottom side alignment option allows for pattern printing on both sides of the substrate.

Specification:

• UV LED light source
• Uniformity<2.5%
• Manual & Automatic Wafer Alignment
• Flood exposure, soft, hard, and vacuum contact capable.
• Topside and backside alignment.
• 1 µm feature size. resolution in thin resist.
• Mask size: 4" , 5'" and 7".
• Sample sizes up to 6'' wafers. BSA of small pieces is supported by a glass chuck.

​Location:

Nano Cleanroom, Nano center building.

Engineering Cleanroom, Wolfson building of Electrical Engineering.

Tool Owner:

Erez Benjamin (erezbenj@tauex.tau.ac.il).

Tool Trainer:

Erez Benjamin (erezbenj@tauex.tau.ac.il).