Magnetron Sputtering PENTA

Magnetron Sputtering PENTA
Magnetron Sputtering PENTA

Manufacturer and model:

Magnetron Sputtering PENTA.

 

Description:

Physical vapor deposition by plasma-based deposition In which positively charged ions from the plasma are accelerated toward target by an electrical field.

Magnetron Sputtering systems for both dielectric (RF magnetron) and metallic materials (DC magnetron).

 

Materials: 

Au, Ag, Al, Cr, Cu, In, Ni, Mo, Si-intr, Ta, Ti, Al2O3, ITO, Ni:Cr(80:20), SiC, SiO2, SiNx, TiN, TiO2.

 

Specification:

  • Up to 6‘’ wafers.
  • Load lock.
  • Base pressure  up to E-8 Torr.
  • 4 magnetron heads (3DC+1RF).
  • Max power DC-500W, RF 300W.
  • Typical deposition rate: 2 Å/sec for Au.


Location:

Engineering Cleanroom, Wolfson building of Electrical Engineering.

 

Tool Owner:

Sergio Bloch (csebta@tauex.tau.ac.il).

 

Tool Trainer:

Edi Mados (edimados@mail.tau.ac.il).

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