Magnetron Sputtering PENTA

Magnetron Sputtering PENTA
Magnetron Sputtering PENTA

Manufacturer and model:

Magnetron Sputtering PENTA.

 

Description:

Physical vapor deposition by plasma-based deposition In which positively charged ions from the plasma are accelerated toward target by an electrical field.

Magnetron Sputtering systems for both dielectric and metallic materials, equipped with substrate heating and cooling capabilities.

 

Materials: 

Au, Ag, Al, Cr, Cu, In, Ni, Mo, Si-intr, Ta, Ti, Al2O3, ITO, Ni:Cr(80:20), SiC, SiO2, SiNx, TiN, TiO2.

 

Specification:

  • Up to 6‘’ wafers.
  • Load lock.
  • Base pressure 2x10-7 Torr.
  • Working pressure 5x10-3 – 80x10-3 Torr.
  • 5 magnetron heads (3DC+2RF).
  • Max power DC-500W, RF 300W.
  • Heating up to 350˚C.
  • Typical deposition rate: 2 Å/sec for Au.


Location:

Engineering Cleanroom, Wolfson building of Electrical Engineering.

 

Tool Owner:

Sergio Bloch (csebta@tauex.tau.ac.il).

 

Tool Trainer:

Eyal Nir (eyal243@gmail.com).

 

Rates & Costs for external Commercial / Industrial:

Clean Room - 200 NIS / hr.

Tool - 440 NIS / hr.

Staff Time - 440 NIS / hr.

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