Magnetron Sputtering Vinci
Manufacturer and model:
VINCI TECHNOLOGIES PVD 20.
Description:
Nearly all materials can be deposited by magnetron sputtering regardless of their melting temperature.
Materials:
Au, Ag, Al, Cr, Cu, In, Ni, Mo, Si-intr, Ta, Ti, Al2O3, BN, ITO, Ni:Cr(80:20), SiC, SiO2, SiNx, TiN, TiO2.
Specification:
- Up to 6‘’ wafers.
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Load lock.
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In situ Ar plasma preclean.
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Base pressure 7.5x10-8 Torr.
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Working pressure 5x10-7 Torr.
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5 heads (1RF/4DC).
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Heating up to 350˚C.
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Typical deposition rate: 8.33 Å/sec for Au, 2.1 Å/sec for Ni, 1.33 Å/sec for Al, 3.5 Å/sec for Cr, 2.25 Å/sec for W.
Location:
Nano center building.
Tool Owner:
Nirit Porecki-Shamay (nporecki@tauex.tau.ac.il).
Tool Trainer:
Dolev Roitman (rdolev@gmail.com).
Rates & Costs for external Commercial / Industrial:
Clean Room - 200 NIS / hr.
Tool - 440 NIS / hr.
Staff Time - 440 NIS / hr.
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