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Homepage of Tel Aviv University
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Magnetron Sputtering PENTA
Magnetron Sputtering PENTA
Description
Specification
Location & Tool Owner
Up to 6‘’ wafers.
Load lock.
Base pressure up to E-8 Torr.
4 magnetron heads (3DC+1RF).
Max power DC-500W, RF 300W.
Typical deposition rate: 2 Å/sec for Au.
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