ALD Beneq
Manufacturer and model:
BENEQ TFS 200.
Description:
The atomic layer deposition (ALD) technique is a highly precise thin-film deposition method based on sequential, self-saturating surface reactions in a controlled ALD system. Compared to sputtering or evaporation, ALD produces highly conformal, uniform thin films with precise thickness control by alternately pulsing source materials.
This ALD system allows for the deposition of thin, conformal layers with atomic-level precision, making it ideal for applications in semiconductor fabrication, nanotechnology, and advanced material research. With its high reproducibility and precise thickness control, our ALD tool is a crucial asset for industries requiring cutting-edge thin-film engineering solutions.
Capabilities:
The system enables controlled, cycle-by-cycle growth of thin films on planar and three-dimensional substrates. Its key capabilities include:
- Precise control of film thickness
- Excellent conformality over complex structures
- High film uniformity across substrates
- Deposition of dielectric, protective, and functional oxide coatings
- Plasma-assisted processing using a range of reactive and inert gases
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