Electroplating Yamamoto

Manufacturer and model:

YAMAMOTO-MS CO TOKYO.

Description:

Electroplating set for 4 inch silicon wafers or custom made dimensions, intended for Nickel coating from Nickel sulfate solutions and Copper coating from Copper sulfate solutions.

Materials: 

Cu, Ni.

Specification:

• Up to 4‘’ wafers.
• Deposition rate is controlled by the current.
• Fast deposition rate compared to other deposition processes, possible to deposite thick layers

​Location:

Room #301, Wolfson building of Electrical Engineering.

Tool Owner:

Dr. Boris Yofis  (boris.yofis@gmail.com)

Tool Trainer:

Roy Marrache (roymarrache@mail.tau.ac.il).