Electroplating Yamamoto
Manufacturer and model:
YAMAMOTO-MS CO TOKYO.
Description:
Electroplating set for 4 inch silicon wafers or custom made dimensions, intended for Nickel coating from Nickel sulfate solutions and Copper coating from Copper sulfate solutions.
Materials:
Cu, Ni.
Specification:
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Up to 4‘’ wafers.
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Deposition rate is controlled by the current.
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Fast deposition rate compared to other deposition processes, possible to deposite thick layers
Location:
Room #301, Wolfson building of Electrical Engineering.
Tool Owner:
Dr. Boris Yofis (boris.yofis@gmail.com)
Tool Trainer:
Roy Marrache (roymarrache@mail.tau.ac.il).