Manufacturer and model:
YAMAMOTO-MS CO TOKYO.
Electroplating set for 4 inch silicon wafers or custom made dimensions, intended for Nickel coating from Nickel sulfate solutions and Copper coating from Copper sulfate solutions.
Up to 4‘’ wafers.
Deposition rate is controlled by the current.
Fast deposition rate compared to other deposition processes, possible to deposite thick layers
Room #301, Wolfson building of Electrical Engineering.
Dr. Boris Yofis (firstname.lastname@example.org)
Roy Marrache (email@example.com).