PECVD PlasmTherm

PECVD PlasmTherm
PECVD PlasmTherm

Manufacturer and model:

Plasma Enhanced CVD – PlasmaTh SLR790.

 

Description:

Plasma enhanced chemical vapor deposition providing low stressed silicon nitride, silicon dioxide and silicon oxynitride thin films.

 

Materials: 

SiO2 and SiNx.

 

Specification:

  • Up to 8‘’ wafers.
  • No load lock.
  • Max temperature 350˚C.
  • Base pressure 10x10-3 Torr.


Location:

Engineering Cleanroom, Wolfson building of Electrical Engineering.

 

Tool Owner:

Sergio Bloch (csebta@tauex.tau.ac.il).

 

Tool Trainer:

Neta Melech (net.melech@gmail.com).

 

Rates & Costs for external Commercial / Industrial:

Clean Room - 200 NIS / hr.

Tool - 440 NIS / hr.

Staff Time - 440 NIS / hr.

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