PECVD PlasmTherm

PECVD PlasmTherm
PECVD PlasmTherm

Manufacturer and model:

Plasma Enhanced CVD – PlasmaTh SLR790.



Plasma enhanced chemical vapor deposition providing low stressed silicon nitride, silicon dioxide and silicon oxynitride thin films.



SiO2 and SiNx.



  • Up to 8‘’ wafers.
  • No load lock.
  • Max temperature 350˚C.
  • Base pressure 10x10-3 Torr.


Engineering Cleanroom, Wolfson building of Electrical Engineering.


Tool Owner:

Sergio Bloch (


Tool Trainer:

Lev Rovinsky (

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