PECVD PlasmTherm
Manufacturer and model:
Plasma Enhanced CVD – PlasmaTh SLR790.
Description:
Plasma enhanced chemical vapor deposition providing low stressed silicon nitride, silicon dioxide and silicon oxynitride thin films.
Materials:
SiO2 and SiNx.
Specification:
- Up to 8‘’ wafers.
- No load lock.
- Max temperature 350˚C.
-
Base pressure 10x10-3 Torr.
Location:
Engineering Cleanroom, Wolfson building of Electrical Engineering.
Tool Owner:
Sergio Bloch (csebta@tauex.tau.ac.il).
Tool Trainer:
Lev Rovinsky (levrovinsky@mail.tau.ac.il).