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ALD Beneq
ALD Beneq
Description
Specification
Location & Tool Owner
Up to 6‘’ wafers.
Load lock.
Precursors Ti, Al, Pt, Hf, Zn, Ta.
Plasma gases Ar, O2, N2, NH3, H2.
Typical deposition rate: 1 Å/cycle for Al2O3 and 0.5 Å/cycle for TiO2.
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PECVD PlasmTherm
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