ALD Beneq

Manufacturer and model:

BENEQ TFS 200.

Description:

The atomic layer deposition (ALD) technique is a highly precise thin-film deposition method based on sequential, self-saturating surface reactions in a controlled ALD system. Compared to sputtering or evaporation, atomic layer deposition (ALD) enables ultra-fine, thickness-controlled growth of materials by alternately pulsing source gases, ensuring exceptional uniformity and conformality.

This ALD machine allows for the deposition of thin, conformal layers with atomic-level precision (~3Å), making it ideal for applications in semiconductor fabrication, nanotechnology, and advanced material research. With its high reproducibility and precise thickness control, our ALD tool is a crucial asset for industries requiring cutting-edge thin-film engineering solutions.

Materials: 

Pt, AlN, Al2O3, TaN, TiN, ZnO, TiO2, Ta2O5, HfO2 .