Deep RIE Versaline DSE

Manufacturer and model:

Deep RIE Versaline DSE.

Description:

Deep Silicon Etcher for High aspect ratio (HAR) micro-nano features as well as for fast isotropic silicon wafer thinning.

Specification:

• Recommended for MEMS production.
• Including Bosch process - the cyclic isotropic etching and fluorocarbon-based protection film deposition.
• Typical Etching rate for 4 inch silicon wafer: ~0.21 um/cycle.

​Location:

Engineering Cleanroom, Wolfson building of Electrical Engineering.

Tool Owner:

Erez Benjamin (erezbenj@tauex.tau.ac.il).

Tool Trainer:

Erez Benjamin (erezbenj@tauex.tau.ac.il).

*Independent work will only be approved after significant experience has been accumulated