Deep RIE Versaline DSE
Manufacturer and model:
Deep RIE Versaline DSE.
Description:
Deep Silicon Etcher for High aspect ratio (HAR) micro-nano features as well as for fast isotropic silicon wafer thinning.
Specification:
- Recommended for MEMS production.
- Including Bosch process - the cyclic isotropic etching and fluorocarbon-based protection film deposition.
- Typical Etching rate for 4 inch silicon wafer: ~0.21 um/cycle.
Location:
Engineering Cleanroom, Wolfson building of Electrical Engineering.
Tool Owner:
Erez Benjamin (erezbenj@tauex.tau.ac.il).
Tool Trainer:
Erez Benjamin (erezbenj@tauex.tau.ac.il).
*Independent work will only be approved after significant experience has been accumulated