Deep RIE Versaline DSE

Manufacturer and model:

Deep RIE Versaline DSE.

Description:

The Deep RIE Versaline DSE is a high-precision DRIE system designed for deep silicon etching, enabling the fabrication of high-aspect-ratio (HAR) micro and nano features. This advanced DRIE machine is also optimized for fast and efficient isotropic silicon wafer thinning, ensuring high uniformity and accuracy.

The DRIE tool supports a wide range of applications in MEMS fabrication, semiconductor processing, and advanced nanotechnology research. Its ability to achieve deep, high-aspect-ratio etching with excellent selectivity makes it an essential system for researchers and industry professionals working with complex silicon structures.