Deep RIE Versaline DSE

Deep RIE Versaline DSE
Deep RIE Versaline DSE

Manufacturer and model:

Deep RIE Versaline DSE.

 

Description:

Deep Silicon Etcher for High aspect ratio (HAR) micro-nano features as well as for fast isotropic silicon wafer thinning.

 

Specification:

  • Recommended for MEMS production.
  • Including Bosch process - the cyclic isotropic etching and fluorocarbon-based protection film deposition.
  • Typical Etching rate for 4 inch silicon wafer: ~0.21 um/cycle.


Location:

Engineering Cleanroom, Wolfson building of Electrical Engineering.

 

Tool Owner:

Erez Benjamin (erezbenj@mail.tau.ac.il).

 

Tool Trainer:

Erez Benjamin (erezbenj@mail.tau.ac.il).

*Independent work will only be approved after significant experience has been accumulated

 

Rates & Costs for external Commercial / Industrial:

Clean Room - 200 NIS / hr.

Tool - 440 NIS / hr.

Staff Time - 440 NIS / hr.

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