VERSALINE™ LLH-DSE-III DRIE
Manufacturer and model:
VERSALINE™ LLH-DSE-III Deep Etching System
Description:
The VERSALINE™ LLH-DSE-III is an advanced plasma-based deep etching system designed for high-aspect-ratio microfabrication and precision material processing.
Built on the modular VERSALINE platform, the system delivers excellent process control, repeatability, and uniformity across a wide range of materials. It supports deep etching processes for semiconductors, dielectrics, and other advanced materials.
The integrated load lock ensures efficient wafer handling while maintaining a stable and clean vacuum environment.
Common Applications:
- Deep reactive ion etching (DRIE)
- MEMS fabrication
- Through-silicon vias (TSV) and advanced interconnects
- Microstructure and trench formation
- Etching of silicon, dielectrics, and other materials
- Semiconductor and microfabrication R&D
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