VERSALINE™ LLH-DSE-III DRIE

Specification:

• Process type: Plasma-based deep etching (DRIE / RIE – configuration dependent)
• High aspect ratio etching capability
• Supports multiple materials (silicon, oxides, nitrides, etc.)
• Platform: VERSALINE modular vacuum system
• Load lock (LLH) for contamination control and improved throughput
• High etch rate with good uniformity
• Precise control of etch depth and profile

System Features:

• Stable plasma processing environment
• Advanced process control for repeatability
• Suitable for complex microfabrication processes
• Expandable modular architecture
• Compatible with research and pilot production