Etch
Etching capabilities at TAU.nano, including advanced deep reactive ion etching (DRIE), allow for precise material removal and the creation of complex nanostructures with high aspect ratios
RIE OerliconA Reactive Ion Etch system with a parallel plate plasma etching, which contributes to an anisotropic thin film etching.
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Deep RIE Versaline DSEDeep Reactive Ion Etcher provides profile control and side wall smoothness.
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Ion Beam Milling AJAPhysical etching technique in a vacuum chamber.
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Plasma PreenA microprocessor controlled microwave oven, which produces plasma within a vacuum chamber.
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Diener Plasma (EBL CR)
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