Evatec BAK501 - Thin Film Deposition System
- Deposition method: Electron-beam Physical Vapor Deposition (e-beam
PVD) - Film thickness range: nanometers to several micrometers
- Substrate size: up to (6") wafers or custom samples
- Base vacuum: < 10⁻⁶ mbar
- Deposition rate: typically 0.1-10 nm/s (material dependent)
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