VST Multifunction PVD System

What is the VST TFDS 6400 used for?

The VST TFDS 6400 is used for depositing high-quality metallic and dielectric thin films using electron beam evaporation and magnetron sputtering.

What deposition techniques are available?

The system supports electron beam evaporation, DC magnetron sputtering, RF magnetron sputtering, reactive sputtering, and co-sputtering.

What materials can be deposited?

The system can deposit a wide range of conductive and insulating materials, including metals, metal oxides, nitrides, and other thin-film materials, depending on the selected targets and process conditions.

What is reactive sputtering?

Reactive sputtering introduces gases such as oxygen or nitrogen during deposition to produce compound thin films, including metal oxides and metal nitrides.

Can the system perform co-sputtering? 

Yes. The sputtering chamber supports simultaneous deposition from two magnetron sources, enabling alloy films, multilayer structures, and multi-component coatings.

What is the advantage of a cluster tool with a load-lock?

A shared load-lock allows samples to be transferred between chambers without breaking vacuum, reducing contamination and improving process efficiency and repeatability.

Which industries and research fields use this system?

The TFDS 6400 is widely used in semiconductor manufacturing, MEMS, photonics, microelectronics, nanotechnology, and advanced materials research