Dual Beam FIB and HR-SEM, Helios 5 UC

Our tool capabilities include:

• Cross Section (CS) - milling and imaging, including EDS (Energy Dispersive Spectrometry) 
• Lamella preparation for TEM measurements (including polish in low KV)
• Milling with Ion beam (Ga+ 30KV)
• Polish with ion beam, including low KV (2-30KV)
• Ion Imaging
• Tomography (3D structure)
• Ion lithography (pattern) - (up to resolution of ~20nm)