KLA P-17 Mechanical Stylus Profilometer

Key Capabilities:

• High-resolution 2D surface topography measurements
• Accurate step height measurements from nanometers up to 1 mm (1000 µm)
• Precise thin film thickness measurement
• Surface roughness analysis
• Etch depth measurement
• Wafer bow and stress analysis
• Programmable scan recipes for repeatable measurements
• Motorized stage for improved positioning accuracy
• Vacuum chuck for stable wafer handling
• Low stylus force with constant force control (0.5-50 mg range)
• Stylus tip radius: 2 µm (optional tips available)

Technical Highlights:

• Advanced force control for delicate samples
• High dynamic range for thick and thin films
• Scan across full wafer diameter without stitching
• Supports wafers up to 150 mm (larger configurations optional)
• Software-driven data analysis and reporting
• Reliable contact metrology for structured and patterned surfaces