Deposition

Deposition

E-beam Evaporator VST (GB)

Physical vapor deposition by Electron beam evaporator.

 

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Nirit Porecki-Shamay | 03-6405710 | nporecki@tauex.tau.ac.il

 

 

E-beam Evaporator VST (Nano)

Physical vapor deposition by Electron beam evaporator

 

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Nirit Porecki-Shamay | 03-6405710 | nporecki@tauex.tau.ac.il

 

 

Magnetron Sputtering Vinci

Physical vapor deposition by plasma-based deposition in which

ions are accelerated toward target.

 

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Nirit Porecki-Shamay | 03-6405710 | nporecki@tauex.tau.ac.il

 

 

Magnetron Sputtering PENTA

Physical vapor deposition by plasma-based deposition in which

ions are accelerated toward target.

 

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Sergio Bloch | 03-6404262 | csebta@tauex.tau.ac.il

 

 

Diode Sputtering MRC 8620

Physical vapor deposition by RF diode sputtering.

 

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Gidon Jacob| 03-6405303 | gjacob@tauex.tau.ac.il

 

 

E-beam Evaporator Vinci

Physical vapor deposition by Electron beam evaporator.

 

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Nirit Porecki-Shamay | 03-6405710 | nporecki@tauex.tau.ac.il

 

 

PECVD PlasmTherm

Plasma Enhanced Chemical Vapor Deposition.

 

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Sergio Bloch | 03-6404262 | csebta@tauex.tau.ac.il

 

 

ALD Beneq

Atomic layer deposition (ALD) is a thin-film deposition technique which is classified as a subclass of chemical vapor deposition.

 

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Inna Shechtman | 03-6405710 | innas@tauex.tau.ac.il

 

 

Electroplating Yamamoto

Electroplating is a process of  metal coating on a metallic sample by an electro-deposition process.

 

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Inna Shechtman | 03-6405710 | innas@tauex.tau.ac.il

 

 

RTP

Rapid thermal processing (RTP) is a process which heats specimen to high temperatures on a timescale of several seconds or less.

 

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Nirit Porecki-Shamay | 03-6404262 | nporecki@tauex.tau.ac.il

 

 

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